Despite advancements in cooling solutions, the interface between an electronic chip and its cooling system has remained a barrier for thermal transport due to the materials' intrinsic roughness. Now, researchers from Carnegie Mellon University and the Massachusetts Institute of Technology have built a flexible, powerful, and highly reliable material to efficiently fill the gap. The material is composed of two thin copper films with a graphene-coated copper nanowire array sandwiched in between. The sandwich material consists of a thermal interface material that has twice the thermal conductance of current state-of-the-art thermal interface materials.
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